James Yoo to Thermal Conductivity
This is a "connection" page, showing publications James Yoo has written about Thermal Conductivity.
Connection Strength
0.034
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Lee H, Yoo JJ, Kang HW, Cho DW. Investigation of thermal degradation with extrusion-based dispensing modules for 3D bioprinting technology. Biofabrication. 2016 Feb 04; 8(1):015011.
Score: 0.034