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Connection

James Yoo to Thermal Conductivity

This is a "connection" page, showing publications James Yoo has written about Thermal Conductivity.
Connection Strength

0.034
  1. Lee H, Yoo JJ, Kang HW, Cho DW. Investigation of thermal degradation with extrusion-based dispensing modules for 3D bioprinting technology. Biofabrication. 2016 Feb 04; 8(1):015011.
    View in: PubMed
    Score: 0.034
Connection Strength

The connection strength for concepts is the sum of the scores for each matching publication.

Publication scores are based on many factors, including how long ago they were written and whether the person is a first or senior author.